Schunk Showcases Solar Cell Gripper At Automatica

Schunk unveiled a dynamic solar cell gripper module, suitable for robot or gantry systems used in solar cell manufacturing, at the recent Automatica exhibition in Munich, Germany. The SZG reliably handles wafers and finished cells measuring 156 x 156mm or 125 x 125mm at extreme speed, according to the company. A transportation cycle of 550mm that includes inspection with a camera system on the return is carried out in a cycle time of less than one second. New and existing facilities can be equipped with this sensitive high-speed gripper, which is actuated with compressed air of 6bar.

The SZG is based on the Bernoulli principle; a low pressure at the gripping surface has the effect that wafers made of crystalline silicium with a thickness of 110 microns are gripped gently but with a high holding force. According to Schunk, special silencers at the gripper bottom side, a polyurethane friction lining and a large support face provide a stress-free and safe grip, where even occurring shearing forces can be absorbed reliably. Integrated micro valves shorten the movement of the compressed air to allow an extremely short response time where wafers can be blown out when they are deposited.

With the combination of this function, large cycle-time savings are achieved. Compared with conventional suction or edge grippers, the wafers are said to be gripped more gently with the Schunk solution. A large area of the cell surface can be mounted at a distance of approximately 7mm. The air flow automatically removes possible dust particles from the wafer.

The company claims that its SZG solar cell gripper achieves shorter cycle times than the conventional Bernoulli gripper thanks to the integrated micro valves. As the cell is located above the gripper, it is possible for a vision system to inspect the complete wafer edge, which increases process quality and reliability in solar cell manufacturing. In order to control the complete process reliably with a vision sensor, the 140 x 140mm base plate can be designed transparently. With a transmitted light, the wafer surface can also be inspected for cracks.

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