Cooling Package Designed For MicroTCA Applications

The Compact Cooling Package (CCP) from Rittal is designed for use in MicroTCA applications where significant amounts of heat are being generated to provide targeted cooling. Each CCP is capable of removing up to 1,200W of heat in an efficient, controlled manner and multiple systems may be distributed within the rack if required. The 482.6mm (19in) rack-mountable CCP comprises a controller managed air/water heat exchanger, 300mm deep, and a 482.6mm fan tray, which can be supplied as a fully wired and piped re-cooling system.

Both major components of the CCP are 1U in height and may be separated by the electronics they are cooling. Supporting all leading IPMI and Rittal CMC-TC (Computer-Multi-Control Top-Concept) protocols, the CCP can be controlled via a CPU. If a fan breaks down or in the event of extreme air temperatures (96h at 55C), the system still remains operational. The use of robust controllers and sensors ensures secure cooling and allows the system to be reliably controlled automatically.

Modular and easy to install, the system can be matched to specific cooling needs due to its flexibility, Rittal said. Applications with ambient temperatures of up to 55C and at 1,800m above sea level are therefore possible. With the increasing compactness of electronic systems, and MicroTCA systems, power losses of 600W and more can be expected per shelf. One Rittal CCP unit will effectively cool two MicroTCA shelves, providing efficient dispersal of heat, and keeping the electronic systems at constant low temperatures by monitoring the internal temperature. Any vertically cooled rack-mount electronic systems can benefit from this development, which has the added advantage that systems placed nearer the top of the rack can receive cooling air at the same temperature as those lower down.

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