Universal Contact Provides Vertical Connection

ITT Interconnect Solutions has launched a universal contact (UC) for angular alignment applications that provides a vertical electrical connection between a device and a PCB. The ITT UC for angular alignment applications has a sloped front beam that enables a mating angle of 90deg and retains the same overall dimensions as a standard UC.

Features include 2.5mm free height with 1mm of deflection and X-Y-X movement with the mating device. A solder well prevents wicking of flux solder into the critical beam area and side wings prevent beam overstress. The UC also includes a domed contact for high hertz forces and 0.3N of pre-load force minimum. The pitch between contacts is 1.35mm.

Electrical specifications include a voltage rating of up to 500V DC. Applications include handsets, where the contacts can be used for solderless component and I/O interconnects as well as battery and antenna contacts. Further applications include memory sticks, GPS board-to-screen interconnects, CT scanning equipment, key fobs and smoke detectors.

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