Harwin Releases EZ Boardware Range

Harwin's EZ Boardware range comprises surface-mount products that improve manufacturing flexibility, reduce manufacturing costs and improve in-field maintenance. With EMC, shielding cans are usually soldered to the board as a secondary operation after the main automated-assembly process.

However, EZ-Shield Clips can be surface mounted, allowing a shielding can to be simply pushed into place during final assembly. EZ-RFI Fingers, also part of the EZ Boardware range, allow for a sliding or wiping contact and simply facilitate electrical contact between PCB and metal cases, yet saving manufacturing costs when compared with using grounding finger strips. When it comes to cable management, EZ-Cable Clips are much smaller and lower profile than equivalent plastic devices.

They are placed directly onto solder pads, thus negating the need to drill retaining holes in the PCB, offering further space and cost savings. EZ-Jumper Links enable designers to eliminate through-hole vias and multi-layer construction. Surface-mount assembly reduces costs and quality is improved through using proven and controlled manufacturing processing.

Lastly, EZ-Test Points provide technicians with easy-to-see test points and minimise the risk of PCB damage by incorrect test methods. Surface-mount assembly also cuts costs.

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