FPCs (flexible printed circuits) are used in a wide range of applications, including mobile devices. Recently, there has been an increase in the use of FPC connectors with impact-resistant backlock mechanisms for mobile devices such as cellular phones, MP3 players, and notebook PCs. In addition, demand is strong for smaller FPC connectors to meet the need to reduce mounting space inside devices accompanying the trend toward smaller and thinner devices.
OMRON Corporation (TOKYO: 6645, ADR: OMRNY) today announced plans to release the XF3C, a low-profile FPC connector with a pitch of only 0.25 mm, in early September. The XF3C represents a 20% reduction in footprint compared to previous OMRON connectors. In response, OMRON developed the XF3C connector, which has a pitch of 0.25 mm, a depth of 3.8 mm (when locked), and a footprint approximately 20% smaller than that of previous OMRON connectors, which had a 0.3 mm pitch. Within its 0.85 mm height, the connector contains the contact structure for both the upper and lower contacts, eliminating the need to differentiate between them and in turn contributing to the standardization of connectors.