Henkel Shows Adhesives For Solar-Module Production
At the 25th European Photovoltaic Solar Energy Conference in Valencia, Henkel will be offering adhesives and sealants for use in the automated production of solar modules. Under its Loctite brand, Henkel has developed a two-component epoxy adhesive that cures ultra fast, resulting in high-strength, reliable bonding of even extremely thin wafer edges. The technology also allows the adhesive to be removed easily and without residues during the cleaning process, with water at a temperature of approximately 60C.
Acetic acid, which causes problems due to its corrosivity, is thus no longer necessary to disbond the wafer from the glass plate and, as a result, the cleaning equipment can be manufactured from less costly materials with a lower level of corrosion resistance. As a systems supplier, Henkel also offers a range of industrial cleaning products for wafer cleaning. At the pre-cleaning stage, P3 products help to remove residues from the slicing process. The lubricant properties of these products also make it easier to separate the individual wafers from one another.
During the main cleaning process, Henkel cleaners remove all silicon scraps, acid and adhesive residues. Henkel's hotmelt adhesive Terostat MS 500 is based on modified silane polymers and offers high initial bond strength directly after assembly, making it suitable for fully automated framing of crystalline modules. Terostat MS 500 achieves instant handling strength, eliminating waiting time. With its ease of handling, Terostat MS 500 also presents advantages over conventional fixing by means of adhesive tapes, as there is no need to perform additional steps such as changing reels or disposing of release paper.
In addition to primerless adhesion to glass, metal and plastics, Terostat MS 500 offers resistance to weathering, providing high-performance all-around sealing that ensures long solar-module life. Henkel will also be offering the Terostat MS 642 for flexible module production, which has a new slot nozzle system to enable fully automatic flat lamination at high speed. This product crosslinks chemically, producing a durable yet elastic bond line with high weathering and temperature resistance.
Acetic acid, which causes problems due to its corrosivity, is thus no longer necessary to disbond the wafer from the glass plate and, as a result, the cleaning equipment can be manufactured from less costly materials with a lower level of corrosion resistance. As a systems supplier, Henkel also offers a range of industrial cleaning products for wafer cleaning. At the pre-cleaning stage, P3 products help to remove residues from the slicing process. The lubricant properties of these products also make it easier to separate the individual wafers from one another.
During the main cleaning process, Henkel cleaners remove all silicon scraps, acid and adhesive residues. Henkel's hotmelt adhesive Terostat MS 500 is based on modified silane polymers and offers high initial bond strength directly after assembly, making it suitable for fully automated framing of crystalline modules. Terostat MS 500 achieves instant handling strength, eliminating waiting time. With its ease of handling, Terostat MS 500 also presents advantages over conventional fixing by means of adhesive tapes, as there is no need to perform additional steps such as changing reels or disposing of release paper.
In addition to primerless adhesion to glass, metal and plastics, Terostat MS 500 offers resistance to weathering, providing high-performance all-around sealing that ensures long solar-module life. Henkel will also be offering the Terostat MS 642 for flexible module production, which has a new slot nozzle system to enable fully automatic flat lamination at high speed. This product crosslinks chemically, producing a durable yet elastic bond line with high weathering and temperature resistance.
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