New Thermal Solution for High Performance COM Express CPU Module
This is an advanced technology which differs from traditional COM Express thermal solutions; DHCS uses a built-in dynamic block to resolve the dimension tolerance between CPU and thermal module, so the block can contact the CPU surface directly and tightly without any gap pad. This revolutionary design shortens the heat conduction path, and makes heat dissipation more efficient. In a direct comparison test with a traditional two-piece thermal module, the thermal solution with DHCS delivered a CPU temperature 20 ˚C lower. This can benefit applications that require high computing performance, and is especially suitable for high-end COM Express solutions and harsh application conditions, such as those in the traffic, medical, and military sectors.
DHCS is different from the traditional thermal module, which usually uses a gap pad as thermal interface material to fill any mechanical gap. In the DHCS solution, we have replaced the gap pad with a self-adjusting copper block that directly contacts the CPU. Moderate pressure keeps the dynamic block in tight contact with the CPU surface for excellent heat transfer. This pulls heat away from theCPU quickly and helps the CPU achieve ultimate computing performance.
In order to improve heat dissipation, we reduced theheat conduction path; now the CPU contacts the copper block directly without any intervening material. Since the DHCS is a compressible and resilient unit, moderate pressure is sufficient to mate the block with the CPU. This reduction in pressure on the CPU die takes a load off the underlying PCB. Reduced loading means the board stays flat.
The DHCS thermal solution uses standard screws for assembly, so users need only follow the torque specification of the screw type to assemble the thermal module to the carrier board. This makes assembly easy, and screw heads can be firmly locked to the thermal module to avoid loosening if the system is to be operated in a vibrating environment.