ESD Protection Devices from TE Connectivity

TTI, a distributor of passive, interconnect, relay and switch and discrete components, has released ChipSESD packages developed by TE Connectivity. These bidirectional silicon-based electrostatic discharge (ESD) protection devices help to reduce assembly challenges because they offer the advantages of an active silicon device combined with a traditional SMT passive body package.

Available in 0201 and 0402 sizes, ChipSESD packages are claimed to be easier to install and rework than traditional semiconductor-packaged ESD devices as they operate bi-directionally and can be placed onto a printed circuit board (PCB) with no orientation constraints, eliminating any need for polarity inspection. While conventional ESD diode packaging has pads on the bottom of the device, the passive packaging of ChipSESDs offers straightforward solder inspection after PCB mounting.

Electrical specifications include a surge rating of 2A under 8x20us surge and an ESD rating of 10kV contact discharge. The devices' low-leakage current (1.0uA maximum) reduces power consumption and a delivers a fast response time (less than 1ns), which helps equipment to pass IEC61000-4-2, Level 4 testing. Their input capacitance of 4.0pF (0201 package) and 4.5pF (0402 package) makes them suitable for applications such as mobile phones and portable devices, digital cameras/camcorders, computer I/O ports, speakers, headphones and low-voltage DE lines.

Felix Corbett, director of supplier marketing in Europe at TTI, said: 'As discrete components become ever smaller, unexpected challenges sometimes arise at any stage, from design through to prototyping and manufacturing process control. 'These new combined bidirectional ChipSESDs developed by TE Connectivity help to eliminate some of these problems, enabling electronics manufacturers to reduce the time to market,' he added. ChipSESDs are available in two sizes: EIA-0201 (SESD0201P1BN-0400-090) and EIA-0402 (SESD0402P1BN-0450-090). Prototype samples are available on request.

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