Protection Devices Housed In Ultra-Small Package
ON Semiconductor has introduced two electrostatic discharge (ESD) protection devices housed in its ultra-small 0201 dual silicon no-lead (DSN-2) package. The DSN-style package, which measures 0.6mm x 0.3mm x 0.3mm, enables 100 per cent utilisation of the package area for active silicon. The company's first offerings in the package are the ESD11N5.0ST5G and ESD11B5.0ST5G, which are an expansion of its high-performance off-chip ESD protection portfolio. By expanding its ESD protection portfolio into an ultra-small package, ON Semiconductor can offer devices that are suitable for safeguarding data lines in portable applications where board space is often extremely limited, such as mobile phones, MP3 players, PDAs and digital cameras. The ESD11N and ESD11B are the next generation of ESD protection technology from ON Semiconductor, which provides best in class clamping voltage. The reduced size and bidirectional single line designs provide ultimate flexibility and ease of routing to fi...